Abstract

Fatima Khammour¹, Ayoub Ainane¹, Moussa Elmatar², Abdelkbir Kenz¹, M’hamed Elkouali¹, Mohammed Talbi¹ and Tarik Ainane^1,3

DOI : http://dx.doi.org/10.13005/ojc/340325

In this article, the plywood panel using a new adhesive formulation of urea formaldehyde resin is evaluated to study the effect of waste mint on the thermal behavior of plywood. The adhesive formulation was loaded by a percentage of waste mint. According to TGA and DSC results obtained by thermogravimetry and differential scanning calorimetry methods, the decomposition temperature of the above mentioned plywood panel (P-WM) is slightly higher compared to the reference plywood (P-REF). The results also show that plywood panel (P-WM) has better thermal stability characteristics than plywood panel (P-REF). The plywood (P-WM) increases the enthalpy of degradation according to DSC results.

Adhesive Formulation; Waste Mint; Plywood; TGA; DSC

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