Novel Bismaleimide-Epoxy Resin System

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Novel (famines, namely N,N'-bis[1 -(2-methyl-4-aminophenyl)ethanoyl]-1,4-benzene-diamine (BMAED 1) and N,N'-bis[1-(4-methyl-3-aminophenyl)ethanoy]-1,4-benzene-diamine(BMAED 2), have been prepared and reacted with various bismaleimides (BM) at a BM:diamine ratio of 1:2.The resulting oligoimides have been characterized by elemental analysis, IR spectral studies and tie number average molecular weight (Mn) estimated by non-aqueous conductometric titration and thermogravimetry. Some of the oligoimides have been modified by addition (i.e. curing reaction of epoxy resin, namely the diglycidyl ether of bisphenol-A, and studied by differential calorimetry (DSC). The glass and carbon reinforced composites have also been prepared and characterized by their mechanical properties.

oligoimides; non-aqueous conductometric titration; calorimetry